SnBi solder wire

• Solder wires made of tin-bismuth-base alloys

Thanks to a new procedure for which a patent has been applied, we will in future be able to offer flux-filled solder wires in the alloy variants Bi58Sn42, Bi57,7Sn42Ag0,3, Bi57Sn42Ag1, BiSn42AgCu with a melting temperature of 138°C or higher.

• The Bi-Sn base alloys produced with this process are characterized by a significantly higher ductility. This will make it possible for the first time to produce flux-filled, low-melting solder wires in series.

• In addition to the low-temperature soldering applications with Bi-Sn(Ag) soldering pastes a corresponding low-melting flux cored wire will also be available.

• R&D project within the funding programme „Central Innovation Programme Central stand“ of the Federal Ministry of Economics and Technology (BMWi)“/EuroNorm